AMD X670 motherboards will have two chipsets

There are just a few months left before the market debut of the expected Ryzen 7000 series processors (codenamed "Raphael") from AMD, which, built on TSMC's 5nm process node, will be based on the new Zen 4 architecture which will introduce several improvements, including a higher IPC, support for technologies such as DDR5 and PCI Express 5.0, and the integration of an RDNA 2-based GPU. Furthermore, the chips will be inserted into the AM5 socket, which will be able to support TDP up to 170W and will maintain compatibility with AM4 heatsinks. The Sunnyvale-based company offered us a taste of the potential of these chips a few hours ago, on the occasion of Computex 2022, of which you can find further details in our previous dedicated article.

Recently, the alleged ASUS Prime X670-P Wi-Fi motherboard scheme, designed for future Ryzen 7000, in which we can see the presence of two chipsets. Rumors have been circulating for a while about ASRock and Gigabyte's X670 motherboards, which would feature a Dual Chipset design. The image was posted on Baidu by an anonymous user, so we don't know how reliable it can be, but this could potentially be a confirmation of past rumors.

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Recall that AMD motherboards with 600 series chipsets will offer up to 24 PCIe 5.0 lanes, up to 14 20Gbps USB Type C, Wi-Fi 6E and DBS / Bluetooth LE 5.2. In addition, the new motherboards can be equipped with up to four HDMI 2.1 and DisplayPort 2.0, useful for taking advantage of the Ryzen 7000's RDNA 2 GPUs.