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Photo Credit: TSMC / Tom Wassick / Twitter According to DigiTimes, the Cupertino company used TSMC's 2.5D CoWoS-S (chip-on-wafer-on-substrate with silicon interposer) packaging process, but apparently this is not correct. In fact, according to a presentation given by TSMC itself at the International Symposium on 3D IC and Heterogeneous Integration, Apple uses Integrated Fan-Out (InFO) technology with Local Silicon Interconnect (LSI) and a Redistribution Layer (RDL).
Photo Credit: TSMC / Tom Wassick / Twitter We remind you that M1 Ultra is almost 8 times faster than M1 and offers a maximum of 20 CPU cores, divided into 14 high-performance cores and 6 high-performance cores efficiency, a maximum of 128GB of RAM (64GB per chip), double the channels and a bandwidth of up to 800GB / s. The graphics sector can count on a GPU with 64 cores, while the Neural Engine is equipped with 32 cores for managing AI loads.